Oxford V.U.E., Inc.
Vis-U-Etch Cupric Chloride Etcher Controller

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Oxford V.U.E., Inc.
11711 Clark St., Ste 108
Arcadia, CA 91006
USA
ph.(626) 256-6557
fax(626) 256-6567
www.oxfordvue.com

CAUSES OF CHLORINE GASSING (in order of usual occurrence)
CAUSE SOLUTION
Low copper content. Get copper up to normal (see text)
Improper calibration. Recalibrate. (Get copper up to normal first)
Too much acid. Turn off VUE flow valve. Find reason for excessive acid. (leaky valve, etc.)
Yellow acid or chlorate. Use water white acid. Yellow "fools" the light cells.
PROBLEMS
PROBLEM CAUSE SOLUTION
Salt crystals form overnight. May clog lines or VUE aspirator. Too much salt in oxidizer. solution Copper level too high. Add water to etch machine. Add less salt to next batch of solution.
Low reading on meters, may ring low set alarm. Copper content to high. Add water or salt water to etch.
  Filters in oxidizer or acid pickup tubes clogged. Clean filters.
  Aspirator plugged with salt or foreign material. Back flush lines with water to clear.
  Etching too fast for VUE to keep up. Allow more space between panels being etched on conveyor.
VUE unable to regenerate fast enough to keep up with etching at all or most times. Aspirator capacity too low. Contact Oxford V.U.E., Inc. for aspirator or Chemical Section upgrade.
Meters too sensitive, may ring high set alarm. Copper content too low. Add sodium chlorate powder as required until normal copper content is reached SEE TEXT. Use titration to determine copper level.
  Etch temperature too low. Raise etch temp. to 125°F (52°C).
System does not come on or goes on and off while regenerating and releasing spent etchant. Filter in etch line dirty. Final filter clogged or salt crystals in the line. Clean Filters.
  Flow valve improperly set. Readjust flow valve to 20 - 25 PSI.
  Etch machine pressure low. Check etch machine pressure at VUE-20 - 25 lbs required.
Etching speed slow. Temperature low. Copper content (and salt) low. Adjust to normal. Check copper content.
  Rinse water diluting etch. Minimize any water drag-in to etch.
Regeneration slow. Filters in oxidizer and/or acid barrel pickup tubes clogged. Clean pickup tubes and lines.
  Etch machine pressure low, causing slow aspiration. Clean filters.
Rapid movements, fluctuations of meters, or insensitivity. Air bubbles in etch. See Manual.
Etch moving backwards, e.g., from etch machine to barrels. Blockage in return line from VUE. Clear constriction or blockage. Check level of salt in etcher. Make sure there are no valves in return line.
  Too much salt in etcher. Verify oxidizer concentration by weighing chemicals first. If correct, reduce salt in next batch.
  Leaky valve. Replace valve.
  Low etch pressure. Bring pressure to 15-25 pounds.
Chlorine gas.   Turn off VUE flow valve. Etch boards until gas is eliminated. See text "Causes of Chlorine Gassing" (above).
Spent Valve won't turn off (spent pumping light is off). Defective valve or valve core. Replace valve or valve core.
Movement in output meter only. Inability to calibrate output meter. Flow Error and/or Bubble Error indicated. Air leak in pickup tubes or fittings on vacuum lines. Look for bubbles in lines and repair.
Acid Flow Error light on, Acid Pumping light on. (Bubble Detector may be on also.) Little or no Acid coming through tubing, bubbles noted in tubing. Locate leak between Acid barrel and Chemical Section. Repair leak.
Oxidizer Flow Error light on, Oxidizer Pumping light on. (Bubble Detector may be on also.) Little or no Oxidizer coming through tubing, bubbles noted in tubing. Locate leak between Oxidizer barrel and Chemical Section. Repair leak.
Acid Flow Error light on, Acid Pumping light off. Acid coming through tubing due to stuck open Acid Valve. Unscrew top of Acid Valve, clean or replace valve or valve core.
Oxidizer Flow Error light on, Oxidizer Pumping light off. Oxidizer coming through tubing due to stuck open Oxidizer Valve. Unscrew top of Oxidizer Valve, clean or replace valve or valve core.
Bubble Detector light on. Small leak in Acid or Oxidizer input tubing. Repair leak.